Microstampings

In addition to producing preforms, Coining stamps small parts – we call them microstampings – that are used as covers, heat sinks, lead frames, tabs, terminals or other components on microelectronic assemblies and packages. We work with Kovar™ , molybdenum, tungsten, copper and various other metallic materials commonly found in metal and ceramic packages. Some of these parts are supplied after plating, with nickel and gold being the most common plating materials. Other stampings are manufactured from cladded strip consisting of two or more metal layers bonded together in a specialty rolling operation.

Coining primarily focuses on two-dimensional microstampings with constant cross-sectional thicknesses less than 0.030 inch (0.75 mm). However, we can produce some parts that vary in the third dimension. We welcome inquires with drawings and will respond quickly with technical feasibility and pricing if appropriate.